Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
US6171714A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1997 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Apr 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.