Method of manufacture of convective accelerometers

US6171880A · kind A · utility

Assignee

• Government of the United States of America, as represented by the Secretary of Commerce · US

Inventors

• Michael Gaitan · North Potomac, US
• Nim Tea · Los Angeles, US
• Edwin D. Bowen · Ramona, US
• Veljko Milanovic · Richmond, US

Key dates

• Filing date: Jun 14, 1999
• Grant date: Jan 9, 2001
• Expiry date: Jun 14, 2019

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P15/18
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method is provided for the manufacture of a convective accelerometer and tilt sensor device using CMOS techniques. An integrated circuit chip is produced which includes a silicon substrate having an integrated circuit pattern thereon including a heater element located centrally of the substrate and at least first and second thermocouple elements located on the substrate on opposite sides of the heater element. Thereafter, portions of the substrate surrounding and beneath the heater and thermocouple elements are etched away to suspend the element on the substrate and thus to thermally isolate the elements from the substrate. The substrate is etched up to the cold thermocouple junction of the thermocouple elements so the cold junction remains on the substrate.