Cadmium-free and lead-free glass compositions, thick film formulations containing them and uses thereof
US6171987A · kind A · utility
16Cited by
16References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 28, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Aug 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/28
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A glass composition comprising, in mole percent of the total composition: PA0 glass-forming compounds in a total amount of 75 to 85%, wherein said glass forming compounds comprise 40 to 65% SiO.sub.2, 10 to 20% Bi.sub.2 O.sub.3 and 0.1 to 3% Al.sub.2 O.sub.3, and PA0 glass modifiers in a total amount of 15 to 25%, wherein said glass modifiers comprise 1 to 23 % ZnO, 0.1 to 5% CuO, 0.1 to 5 CaO and 0.1 to 2% MgO, thick film formulations containing said composition and uses thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.