Methods for mounting an imager to a support structure and circuitry and systems embodying the same
US6172361A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Dec 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The method of mounting a semiconductor device 200 on a supporting structure 101, the semiconductor device having a surface 201 including a defined area 202 for receiving photons and a plurality of conductors 203/204 for establishing connections to the device. An aperture 301 is formed through the supporting structure, the aperture sized to correspond to a size of the defined area of the semiconductor device. Conductors 302 are formed on the supporting structure adjacent to the aperture in a pattern corresponding to the pattern of the conductors on the semiconductor device. The semiconductor device is mounted to the supporting structure such that the conductors on the semiconductor device contact the conductors on the supporting structure where the defined area of the semiconductor device is exposed to photons through the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.