Semiconductor device and a manufacturing method thereof
US6172422A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Oct 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a semiconductor device for mounting an LSI bare-chip component, or a bare chip, on a printed circuit board, or a substrate, with flip-chip bonding technology, comprises a recess forming step of forming recesses on substrate pads of the substrate, an adhesive coating step of applying adhesive to a location on the substrate at which the bare chip is to be placed, a chip mounting step of placing the bare chip on the substrate while aligning the positions of the bumps formed on the chip pads of the bare chip and the substrate pads of the substrate, and an adhesive hardening step of hardening the applied adhesive. Also disclosed is a semiconductor device manufactured with the above-mentioned manufacturing method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.