Encapsulation of transmitter and receiver modules

US6172425A · kind A · utility

Assignee

• Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

• Odd Steijer · Bromma, SE
• Josef Bakszt · Huddinge, SE
• Paul Eriksen · Djurås, SE

Key dates

• Filing date: Oct 28, 1997
• Grant date: Jan 9, 2001
• Expiry date: Oct 28, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An encapsulated optocomponent has an optocomponent assembly having an optical interface at one side, which has guide pins for positioning a connected optical component or optical connector. The assembly is attached to the outermost portion of a flexible tongue, which is an integral part of a dielectric carrier such as a polymer carrier. On or inside the carrier and the tongue thereof electrical conductive paths are arranged which are connected to the optoassembly and to electrical driver circuits in a driver circuit assembly, so that the carrier also has the function of a conventional lead frame. The entire device is molded into encapsulating plastic material. In the molding operation the positioning of the optoassembly in an accurately determined position and the retainment thereof in this position is facilitated by the flexibility of the tongue, not being affected for example by the fact that an injected encapsulating material may possibly displace the significantly larger driver circuit assembly and its attachment area on the carrier. This construction can also allow that only the optoassembly is encapsulated, the driver circuit assembly being protected in some other way, so tha…