Stable metallization for electronic and electromechanical devices
US6173612A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1998 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0828
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described are various improved methods of forming electronic devices, electro-mechanical devices, force-sensing devices, and accelerometers. Also described are various improved electronic devices, electro-mechanical devices, force-sensing devices, and accelerometers. The device comprises a plurality of vibrating beams joined with a support portion and configured for movement relative to the support portion. A layer of electrically conductive material is disposed over at least some of the surface of the moveable portion and support portion, the layer comprising an inert or a noble material having a Young's modulus which is greater than that of elemental gold. Alternatively, the layer may comprise an inert material having a coefficient of expansion which is less than that of elemental gold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.