Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium
US6173883A · kind A · utility
3Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1998 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Nov 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal mass (18) is reflow soldered atop of a multi-layered medium (10) in order to yield minimum thermal resistance between a heat source (22) located on the multi-layered medium (10) and the thermal mass (18) for greater heat dissipation efficiency. Moreover, the thermal mass (18) can be auto-placed onto the multi-layered medium (10) in order to accurately and closely position the thermal mass (18) next to the heat source (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.