Socket for IC and method for manufacturing IC
US6174174A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 28, 1999 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/931
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A socket for an IC used in electrically connecting the IC to a test device for testing electrical properties of the IC. The socket for an IC includes a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC, with the opening facing the anisotropic electrically conductive adhesive. The socket for an IC also includes a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening. The contact electrodes and the coil-shaped contacts facing each other via the anisotropic electrically conductive adhesive are mechanically and electrically connected to each other via the a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.