Bow compensated lapping
US6174218A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1999 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Apr 21, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3103
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.