Heat-reducing silicone grease composition and semiconductor device using the same
US6174841A · kind A · utility
32Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1999 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Oct 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A heat-reducing silicone grease composition comprising a mixture of (A) 50-95 weight % of aluminum nitride powder having an average particle size of 0.5-10 .mu.m and containing no particles 100 .mu.m or greater in size, (B) 5-50 weight % of liquid silicone having a viscosity of 50-500,000 cs at 25.degree. C. and (C) 0-30 weight % of at least one powder selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders; and a semiconductor device to which the foregoing silicone grease composition is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.