Metal-base multilayer circuit substrate having a heat conductive adhesive layer
US6175084A · kind A · utility
34Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1996 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Apr 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal-base multilayer circuit substrate has a metal plate and a circuit substrate bonded to the metal plate, by an insulating adhesive layer containing at least one of metal oxides and/or at least one of metal nitrides. The adhesive layer has high heat conductivity and allows for a metal-base multilayer circuit substrate having excellent heat dissipating properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.