Method of processing a material by means of a laser beam
US6175096A · kind A · utility
70Cited by
3References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/067
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of processing material with a laser beam. The material has two surfaces. The beam is focused by a multilens objective in a number of focal points which are approximately positioned on a common axis with an angle to the first surface. The focal points are spaced apart and used for cutting plates with several focal points being utilized for melting and cutting the plate material. As a result, a good cutting notch is obtained with good separation of the cut parts and poor adhesion of slag.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.