Surface mount thermal connections
US6175500A · kind A · utility
12Cited by
5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 22, 1998 |
| Grant date | Jan 16, 2001 |
| Priority date | — |
| Expiry date | Sep 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.