Cooling apparatus for electronic devices
US6176299A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1999 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Feb 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Disclosed herein is a cooling device primarily for cooling integrated circuits or other electronic devices during operation. The cooling device may include a heat sink portion and a fan, or other air movement device. The outer periphery of the heat sink portion may be formed with outwardly extending lobes, leaving recessed areas between the lobes. The lobes may be sized and located so as to correspond to heat concentration areas on an electronic device package. In this manner, heat sink material may be concentrated adjacent heat concentration areas where more heat removal is required. The overall mass and size of the heat sink portion may, thus, be reduced without significantly impairing the ability of the cooling device to remove heat from an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.