Modular Microelectronic connector and method for manufacturing same
US6176741A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 20, 1999 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Apr 20, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A simplified modular microelectronic connector having an internal component cavity and integral crimped leads, and a method of manufacturing same. One or more electrical components are located within the cavity, with their conductors being routed to the crimp leads integral to the connector body. The conductor terminations are completed via crimping or other bonding techniques. The crimped leads are deformed into the desired position to minimize connector size, and the component is sealed within the cavity using an epoxy or other electrically non-conductive material. The connector body may be further mounted to a multi-connector carrier assembly, which utilizes one or more pins to secure the individual connectors to the carrier so that they may be arranged in both vertically-stacked and horizontal ("side-by-side") configurations, and each connector may be removed separately and replaced in the event of component failure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.