Radiation curable poly(1-alkene) based pressure-sensitive adhesives
US6177190A · kind A · utility
26Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2878
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to pressure-sensitive adhesive compositions. The compositions comprise a poly(1-alkene) pressure-sensitive adhesive component, a non-pressure-sensitive adhesive component, and a radiation-activatable curing agent. The invention further provides pressure-sensitive adhesive tapes and methods for making the compositions and tapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.