Simultaneous diffusion bonding of an array of like parts
US6177203A · kind A · utility
2Cited by
12References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Nov 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24298
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Diffusion bonding techniques are extended to the simultaneous bonding of an array of multilevel piece parts. The problems of uneven expansion and contraction of different levels of different piece parts in the array are obviated by positioning each level of the array within a frame. The stack of frames is pinned in one corner. The opposite corner of the array has a slot at a 45.degree. angle with respect to the x and y axes of the array. The slot engages a pin and allows the entire array to expand and contract along the slot in a manner to maintain the registration of features between respective levels of each piece part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.