Semiconductor cleaning apparatus
US6177356A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Jun 4, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer device or boat and semiconductor cleaning apparatus including a wafer transfer device and a heatable reaction core is provided. The wafer transfer device has a first unit with a plurality of first slots for receiving a first group of semiconductor wafers and a second unit with a plurality of slots for receiving a second group of semiconductor wafers. The first slots alternate with the second slots. The first unit is connectable to a first voltage source and the second unit is connectable to a second voltage source. The second voltage source is more electronegative than the first one. Typically, the first group of semiconductor wafers have impurities therein which are to be removed and the second group of semiconductor wafers are to receive the impurities. A method for protecting a plurality of semiconductor wafers includes the steps of placing the plurality of semiconductor wafers within a heatable reactor core, having a core collector electrode mounted on the outside of the heatable reactor core and having a conductive element located within the reactor core. The core collector element receives a first voltage level, and the conductive element receives a second vo…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.