Semiconductor encapsulating epoxy resin composition and semiconductor device
US6177489A · kind A · utility
24Cited by
14References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Jan 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25.degree. C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.