Electronic component installation method
US6178626A · kind A · utility
19Cited by
17References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1999 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Jan 22, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic component installation device for manufacturing an electronic circuit substrate, wherein components are picked up from a parts supply device and placed on a circuit substrate, the height of the installing surface s of an electronic component 10 from a reference surface is detected with the use of a three-dimensional imaging device 2, and the distance the suction nozzle 9 of the mounting head 1 is lowered is accurately determined with respect to each of electronic components that vary in thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.