Apparatus and method for direct attachment of heat sink to surface mount
US6178628A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1998 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Sep 11, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for thermally coupling a heat sink directly to a surface mount heat generating device package in a manner which provides a more efficient thermal path between the heat sink and the device package, and which allows for a simplified assembly process. The heat sink is mounted in direct thermal communication with the heat generating device package which is surface mounted to a printed circuit board or other substrate. The inventive heat sink has a reservoir of thermal preform which allows the heat sink to be secured to a device package at the same time as the device package is being secured to the surface mount substrate, as opposed to doing so in a separate step in the assembly process after the electronic device packages have already been secured to the surface mount substrate. The inventive heat sink thereby simplifies the assembly process by eliminating steps in the manufacturing process and by allowing for the further automation of the assembly process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.