Chemical mechanical polishing apparatus and method
US6179695A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 1997 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | May 9, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/047
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus and method can polish a surface of an object very precisely at a high speed irrespective of the presence of a local defect on the surface to be polished. By using a multiplex ring-shaped polishing pad, an effective surface to be polished is increased, and very precise and uniform polishing can be performed at a high speed. By using a plurality of polishing pads, having different diameters smaller than the diameter of the surface to be polished, provided with an interval on the same revolution radius on a revolution table, or by using a plurality of polishing pads, having the same diameter smaller than the diameter of the surface to be polished, provided at positions having different revolution radii on a revolution table, very precise and uniform polishing can be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.