Method and apparatus for aligning the bonding head of a bonder, in particular a die bonder
US6179938A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 1998 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Oct 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of aligning the bonding head of a bonder, in particular a die bonder, or of a pick and place machine comprising the steps of a) placing an alignment plate provided with two plane parallel surfaces on a supporting surface which is set plane parallel to the bonding surface upon which the semiconductor chip will be bonded to the carrier material; b) calibration of a measuring device, the signal of which is dependent upon the position of the alignment plate; c) grasping the alignment plate with the bonding head of the bonder and holding the alignment plate free at a slight distance above the measuring device; and d) alignment of the bonding head until the signal from the measuring device is equal to the signal following step b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.