Apparatus and method for etching printed circuit board
US6179954A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1999 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Apr 21, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B14/40
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An etching apparatus for etching a printed circuit board includes a transport mechanism for horizontally transporting a printed circuit board in a transporting direction so that a height of the printed circuit board during etching is kept at a transport position, a plurality of upper spray nozzles for injecting an etchant to a top surface of the printed circuit board transported by the transport mechanism, and a plurality of lower spray nozzles for injecting an etchant to a bottom surface of the printed circuit board. In the etching apparatus, a flow rate of the etchant injected to the top surface of the printed circuit board is made greater than a flow rate of the etchant injected to the bottom surface of the printed circuit board by an arrangement of the upper spray nozzles and the lower spray nozzles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.