Control of size and heat affected zone for fine pitch wire bonding
US6180891A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 1997 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Feb 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The amount of melting of the bonding wire is closely regulated, and reduction of size and improvement of uniformity of the free air ball is obtained for ball bonding at pitches of less than ninety mils even when bonding wire of reduced diameter is employed. Quenching of the bonding wire adjacent to the free air ball also limits the temperature rise in the bonding wire and the extent of a heat affected zone having less tensile strength and stiffness to less than one micron and with reduced grain enlargement. The present invention provides such a bond for electronic packaging of increased reliability, potential functionality, increased manufacturing yield and reduced process complexity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.