Printed circuit board and method for fabricating such board
US6181219A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1998 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Dec 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0455
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly having a pair of printed circuit boards. Each one of the boards has a conductive via passing from a surface of a dielectric into an interior region of the dielectric. Each one of the printed circuit boards has a reference potential layer and a signal conductor disposed in the dielectric thereof parallel to, the reference potential layer thereof to provide a transmission line having a predetermined impedance. The signal conductor of each one of the boards is connected to the conductive via thereof. The conductive via in each one of the boards is configured to provide an impedance to the transmission line thereof substantially matched to the impedance of the transmission line thereof. A first electrical connector is provided having a signal contact connected to the conductive via of one of the boards and a second electrical connector having a signal contact connected to the conductive via of the other one of the boards. The first signal contact of the first electrical conductor is adapted for electrical connection to the second contact of the second electrical connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.