Optical module packaged with molded resin
US6181854A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1999 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Jul 13, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4292
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module including a plurality of leads, a substrate having a first groove and a plurality of conductor patterns electrically connected to the leads, a ferrule having a center hole in which an optical fiber is inserted and fixed, the ferrule being mounted in the first groove of the substrate so that one end of the ferrule projects from an end surface of the substrate, and an optical element mounted on the substrate for making conversion between light and electricity. The optical module further includes a transparent first resin for covering at least the optical element and the other end of the ferrule, and a second resin for enclosing all of the leads, the substrate, the ferrule, the optical element, and the first resin except the one end of the ferrule and a part of each of the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.