Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate
US6183669A · kind A · utility
28Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2000 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Mar 9, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4629
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
There is disclosed a paste composition including (A) an organic binder comprising acidic functional groups; (B) an inorganic powder containing multivalent metal compounds; and (C) a mono-ol compound having a boiling point of about 178.degree. C. or more. The paste composition enables various fine patterns such as via-holes with high precision, by suppressing gelation caused by mixing an organic binder having acidic functional groups and a compound containing multivalent metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.