Apparatus and method for embossing and printing elongated substrates
US6183671A · kind A · utility
14Cited by
14References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1999 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Jan 29, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41F19/02
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for printing and embossing elongated substrates provide for both length and position registration with respect to the printed and embossed patterns. The ink pattern to embossed pattern error is corrected by stretching or relaxing the substrate between the printing and embossing assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.