Electronic circuit substrates fabricated from an aluminum ceramic composite material
US6183875A · kind A · utility
7Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1998 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Oct 26, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An electronic circuit substrate including an aluminum-ceramic composite material having an electronic circuit formed on aluminum or an aluminum alloy plate of the aluminum-ceramic composite material which is prepared directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.