Method and apparatus for hardening a layer on a substrate
US6185840A · kind A · utility
13Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1998 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Jan 26, 2018 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF26B3/283
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A layer which can be hardened by radiation is located on a substrate surface of paper, glass, plastics, wood or metal. The layer on the substrate, which is guided through a hardening stage, is subjected to radiation with ultraviolet light whilst the lamp chamber is flushed directly with a gas. The layer can be simultaneously tempered and rendered inert or treated in a chemically active manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.