Jet soldering system and method
US6186192A · kind A · utility
25Cited by
22References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1997 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Aug 7, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for filling filtered solder into replaceable solder cartridges for use in a system for depositing a selected pattern of solder onto a substrate on which electronic components are to be mounted. The apparatus includes a cartridge support, an environmentally-controlled chamber, a solder receptacle, a heater, a molten solder flow conduit, and a separator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.