Method and device for the precise electrolytic deposition and etching of metal layers on circuit boards and conductors foils in continuous systems
US6186316A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Jun 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention concerns a process for precise electrolytic precipitation and etching of metals up to the marginal area of printed-circuit board and printed-circuit film panel in a continuous-cycle plant. In continuous-cycle plants, the panels are grasped by clips at least at one edge. The clips are used for current supply to the panels and, if necessary, for transporting the latter. Among other factors, owing to the shielding effect of the clips there are great plate thickness differences in the marginal area of the panels. This marginal area cannot be used for precise printed-circuit boards. The invention improves the plate thickness distribution in this marginal area by separating the plant into several partial plants and a defined offset V of the clip gripping points from plant part to plant part. The offset is preferably adjusted to values corresponding to the quotient of the clip distance T and the number of subsequently arranged plant parts. The distance is kept constant by electrical or by mechanical measures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.