Method of cleaving a brittle material using a point heat source for providing a thermal stress
US6186384A · kind A · utility
64Cited by
12References
20Claims
0Family size
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Key dates
| Filing date | Mar 1, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Mar 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of determining optimum heating conditions for applying a pulse laser point heat source onto a strip of a brittle material at its position in the vicinity of a tip of a crack of the strip for cleaving the strip by a thermal stress, wherein at least one of a non-dimensional pulse time of the pulse laser point heat source, a non-dimensional distance of the pulse laser point heat source from the tip of the crack, and a non-dimensional heating area is decided so that a ratio of non-dimensional stress intensity factor to temperature takes just or approximately a maximum value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.