Bond for abrasive tool
US6187071A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Jan 14, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bond for a single layer metal bond abrasive tool can be easily chemically and electrochemically stripped from the metal core of a recovered used tool to facilitate reuse of the core. Relative to conventionally bonded tools, the speed of stripping the novel bond is quick, and the stripped core has a smooth, clean surface which needs only minimal mechanical repair prior to reuse. In one aspect, the novel bond is a quaternary bond composition consisting essentially of copper, tin, titanium and silver. The powder components can be used dry or mixed with a fugitive liquid binder as a paste. The novel bond can be brazed at lower temperature than copper/tin/titanium bonds prepared otherwise. The bond composition forms a good melt at braze temperature that flows smoothly, evenly over a tool preform and provides consistent quality bonding of abrasive from tool to tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.