Patent · US Expired

Device for coating plate-shaped substrates

US6187158A · kind A · utility

0Cited by

4References

11Claims

0Family size

Assignee

Leybold Systems GmbH · DE

Inventors

Manfred Schuhmacher · Alzenau, DE
Andreas Sauer · Großostheim, DE
Katja Grundmann · Großkrotzenburg, DE

Key dates

Filing date	Jul 30, 1999
Grant date	Feb 13, 2001
Priority date	—
Expiry date	Jul 30, 2019

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C14/568
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A device for coating plate-shaped substrates by using cathode sputtering has several process chambers one after the other, each of which are bordered on the top by a chamber roof having in each case an opening. In this opening, which is covered at the top by a cathode arrangement, a frame is inserted. Screens and coolant lines of the process chamber are provided on the frame that can slide upwards out of the opening, projects into the process chamber, and is supported inside the opening of the chamber roof. A top of the cathode arrangement projects over the frame on the sides and is supported directly on the chamber roof so it seals it.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.