Nanoporous polymer films for extreme low and interlayer dielectrics
US6187248A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1998 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Nov 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for producing a nanoporous polymer film of no greater than 10 micron thickness having low dielectric constant value, including the steps of: (a) providing a polymer in a solution with at least two solvents for the polymer in which a lowest boiling solvent and a highest boiling solvent have a difference in their respective boiling points of approximately 50.degree. C. or greater; (b) forming a film of the polymer in solution with at least the two solvents on a substrate; (c) removing a predominant amount of the lowest boiling solvent; (d) contacting the film with a fluid which is a non-solvent for the polymer, but which is miscible with the at least two solvents to induce phase inversion in the film; (e) forming an average pore size in the film in the range of less than 30 nanometers. The present invention is also nanoporous films made by the above process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.