Exposed heat spreader with seal ring
US6188130A · kind A · utility
28Cited by
22References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Jun 14, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package comprising: (a) at least one semiconductor device; (b) a metal heat spreader that has at least one surface exposed to ambient and the perimeter of that exposed surface having a seal ring border; (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device; and (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.