Inkjet printhead with preformed substrate
US6188414A · kind A · utility
54Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/21
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A robust printhead is disclosed comprising a substrate, an ink flow channel formed in the substrate, a beveled die having disposed heater resistors and which is inserted into the substrate, a TAB circuit used to electrically couple the beveled die to the substrate, and an encapsulated upper surface. The encapsulant is disposed at least over the electrical coupling between the beveled die and the interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.