Apparatus for heat treating a semiconductor wafer to reduce stress
US6188838A · kind A · utility
18Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1999 |
| Grant date | Feb 13, 2001 |
| Priority date | — |
| Expiry date | Feb 2, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/931
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A susceptor in a semiconductor wafer heat treatment apparatus holds a wafer such that the wafer is made flat at a heat treatment temperature. In particular, the susceptor is constituted by an elastic platy member which is convex upward with respect to the direction of the gravity. Therefore, when the wafer is subjected to a high-temperature heat treatment, a crystal defect in the wafer can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.