Using ion implantation to create normal layers in superconducting-normal-superconducting Josephson junctions

US6188919A · kind A · utility

Assignee

• TRW Limited · US

Inventors

• John LaGraff · Niskayuna, US
• James M. Murduck · Ellicott City, US
• Hugo W. K. Chan · Rancho Palos Verdes, US

Key dates

• Filing date: May 19, 1999
• Grant date: Feb 13, 2001
• Expiry date: May 19, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S505/702

Abstract

A SNS Josephson junction (10) is provided for use in a superconducting integrated circuit. The SNS junction (10) includes a first high temperature superconducting (HTS) layer (14) deposited and patterned on a substrate (18), such that the first HTS layer (14) is selectively removed to expose a top surface of the substrate (18) as well as to form an angular side surface (22) on the first HTS layer (14) adjacent to the exposed top surface of the substrate (18). Ion implantation is used to form a junction region (12) having non-superconducting properties along the angular side surface (22) of the first HTS layer (14). A second HTS layer (16) is then deposited and patterned over at least a portion of the first HTS layer (14) and the exposed top surface of the substrate (18), thereby forming a SNS Josephson junction.