Method of forming solder bump and method of mounting the same
US6189771A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Oct 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder bump formation method and solder bump mounting method for forming a solder bump by soldering a solder ball 9 onto an electrode 2 provided at the bottom of a cavity 3 on a substrate 2 which has an opening shape through which the solder ball 9 cannot go. Metal paste 5, containing metal having a higher liquidus temperature than that of solder used for the solder ball 9, is filled into the cavity 3. The solder ball 9 is placed on the cavity 3, and then heated to the temperature higher than the liquidus temperature of the solder ball 9. During the heating process, metal in the metal paste 5 remains unmelted in the cavity 3 when the solder ball 9 melts. This enables the metal to direct the melted solder to the electrode 2 at the bottom of the cavity 3, achieving good soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.