Direct nozzle plate to chip attachment
US6190492A · kind A · utility
27Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1995 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Oct 6, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Separate adhesive is avoided in the manufacture of a thermal ink jet printhead by positioning a thermoplastic nozzle plate (1) on a semiconductor circuit chip (3) and electrically firing the ink ejection resistors (5) in a controlled amount to melt the lower surface in contact with the chip while not damaging the body of the nozzle plate. The resistors are fired in their intended pattern of operation during use so not to damage the resistors. Additional resistors may be added just for this bonding operation if needed with particular chip designs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.