Thin-film multilayer wiring board and production thereof
US6190493A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1997 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Nov 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1093
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin-film multilayer wiring board comprising a first and a second metallic wiring layers formed on a substrate with an organic insulating layer interposed between the metallic wiring layers, wherein the lands of the first and second metallic wiring layers are electrically connected by via studs made of a conductive metal filler formed by electroless plating, and the difference between the top end diameter and the base diameter of each via stud is 10% or less, or the angle made by the taper of the interface between the insulating layer and each via stud against the axis thereof is 5.degree. or less, can provide a high wiring density and signal transmission performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.