Ultrasonic transducer
US6190497A · kind A · utility
7Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Apr 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85205
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.