Hydrophilic pressure sensitive hot-melt adhesives
US6190689A · kind A · utility
41Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1996 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Nov 13, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J11/00
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A device for the release of substances from pressure sensitive hot-melt adhesives with a uniform or non-uniform distribution of said substances is characterized by the fact that the pressure sensitive hot-melt adhesive is hydrophilic and comprises at least one water-soluble, or at least water-swellable, polymer, at least one water-soluble, meltable adhesive resin, as well as substance to be released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.