Method and connection arrangement for producing a smart card

US6190942A · kind A · utility

Assignees

• PAV Card GmbH · DE
• Siemens Aktiengesellschaft · DE
• EVC Rigid Film GmbH · DE

Inventors

• Robert Wilm · Dresden, DE
• Detlef Houdeau · Langquaid, DE
• Robert Reiner · Neubiberg, DE
• Rainer Rettig · Amagasaki, JP

Key dates

• Filing date: Jun 9, 1999
• Grant date: Feb 20, 2001
• Expiry date: Jun 9, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

The invention concerns a process and a connecting arrangement for producing a chip card, wherein a semiconductor chip on a module is fitted in an opening in a card carrier with the attainment of an electrical and mechanical connection. In accordance with the invention, in place of connections which were hitherto necessary involving a force-locking relationship and/or involving the materials being bonded together, recourse is made to inductive and/or capacitive coupling between the module and the IC-card. For that purpose the module and the card correspondingly have coils and/or capacitive coupling surfaces for signal transmission purposes.