Electronic device including a densified region
US6191492A · kind A · utility
26Cited by
2References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1993 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Dec 6, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.