Reflow solder convection oven with a passive gas decontamination subsystem
US6193774A · kind A · utility
15Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Feb 19, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/008
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A reflow solder convection oven with a passive gas decontamination subsystem. This subsystem includes an intake duct in fluid communication with the gas outtake of a heating zone of the oven, at least one decontamination duct connected on one end to the intake duct, the decontamination duct including a plurality of collision baffles therein for collecting contaminants from the gas in the oven, and an outtake duct connected to the decontamination duct on an end opposite the intake duct and in fluid communication on an opposite end with the gas intake of the heating zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.